Intel’s New U.S. Fab to Specialize in 450mm Wafers

According to an EETimes.com report, Intel put to rest all the recent speculation surrounding its new U.S. fab and confirmed it’s being constructed to handle 450mm wafers.

As part of a $6 billion to $8 billion investment, Intel is upgrading several U.S. facilities for 22nm production, as well as building the aforementioned fab in Hillsboro, Oregon. This will be known as D1X and it will go live in 2013.

“Intel is very interested in 450mm,” said Mark Borh, Intel Senior Fellow and director of process architecture and integration at Intel. “D1X is being (constructed) to be compatible with 450mm.”

The upshot to increasing wafer size like this is that Intel can squeeze more chips out of a single wafer and potentially reduce manufacturing costs.

300mm wafer shown

Related posts:

1. Intel on Track for 300mm Fab in China
2. Intel Hit With $1.45 Billion Fine From EU
3. Intel to Invest $7 Billion in U.S. Facilities
4. Intel Delivers Strong Q4 Results, Cites Return of Consumer Demand
5. Intel Performs Well in Third Quarter, Confident about Future Ahead

Tags: 450mm, fab, Intel, manufacturing, News Worthy, technology, wafer

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